AS4C2M32D1A-5BIN

Basic Information Overview

• Category: Integrated Circuit (IC)
• Use: Memory module
• Characteristics: High-speed, low-power consumption
• Package: BGA (Ball Grid Array)
• Essence: Dynamic Random Access Memory (DRAM)
• Packaging/Quantity: Tray packaging, 100 pieces per tray

Specifications

• Part Number: AS4C2M32D1A-5BIN
• Organization: 2 Meg x 32
• Voltage: 3.3V
• Speed: 5ns
• Interface: Parallel
• Operating Temperature: -40°C to +85°C
• RoHS Compliance: Yes

Detailed Pin Configuration

The AS4C2M32D1A-5BIN has a total of 90 pins. The pin configuration is as follows:

| Pin Number | Pin Name | Description | |------------|----------|-------------| | 1 | VDD | Power supply voltage | | 2 | VDDQ | Power supply voltage for I/O buffers | | 3 | DQ0 | Data input/output bit 0 | | 4 | DQ1 | Data input/output bit 1 | | ... | ... | ... | | 89 | WE | Write enable | | 90 | VSS | Ground |

Functional Features

• High-speed operation: The AS4C2M32D1A-5BIN offers fast data access with a speed of 5ns.
• Low power consumption: It is designed to operate at a low voltage of 3.3V, reducing power consumption.
• Large storage capacity: With an organization of 2 Meg x 32, it provides a total storage capacity of 64 Megabits.
• Reliable performance: The DRAM technology used in this module ensures reliable and efficient memory operations.

Advantages and Disadvantages

Advantages: - High-speed operation allows for quick data access. - Low power consumption helps in reducing energy usage. - Large storage capacity meets the requirements of memory-intensive applications.

Disadvantages: - Being a dynamic memory, it requires periodic refreshing to retain data. - Sensitive to external factors such as temperature and voltage fluctuations.

Working Principles

The AS4C2M32D1A-5BIN is based on Dynamic Random Access Memory (DRAM) technology. It stores data in capacitors within its memory cells. To read or write data, the memory controller sends appropriate signals to the address and control pins of the module. The data is then accessed by activating the corresponding row and column addresses.

Detailed Application Field Plans

The AS4C2M32D1A-5BIN is commonly used in various electronic devices and systems, including: - Personal computers - Servers - Networking equipment - Embedded systems - Consumer electronics

Detailed and Complete Alternative Models

• AS4C2M32D1A-5BCN: Similar specifications but with different packaging (TSOP)
• AS4C2M32D1A-5BCN-T: Same as AS4C2M32D1A-5BCN, but with tape and reel packaging
• AS4C2M32D1A-5BCN-TR: Same as AS4C2M32D1A-5BCN-T, but with extended temperature range

These alternative models provide flexibility in terms of package type and temperature range, allowing for compatibility with different system requirements.

In conclusion, the AS4C2M32D1A-5BIN is a high-speed, low-power consumption memory module belonging to the category of integrated circuits. With its large storage capacity and reliable performance, it finds applications in a wide range of electronic devices and systems.