MX30UF1G18AC-TI

Product Overview

• Category: Integrated Circuit (IC)
• Use: Memory device
• Characteristics: High-speed, low-power, non-volatile memory
• Package: Surface Mount Technology (SMT)
• Essence: Flash memory
• Packaging/Quantity: Tape and reel packaging, quantity varies

Specifications

• Memory Type: Universal Flash Storage (UFS)
• Density: 1 Gigabit (1 Gb)
• Voltage Range: 2.7V - 3.6V
• Operating Temperature: -40°C to +85°C
• Interface: MIPI UniPro v1.8, JEDEC UFS v2.1
• Data Transfer Rate: Up to 5.8 Gbps (Gear 4)

Detailed Pin Configuration

The MX30UF1G18AC-TI IC has the following pin configuration:

1. VCCQ
2. VCC
3. RST#
4. CLK
5. CMD
6. DATA[0]
7. DATA[1]
8. DATA[2]
9. DATA[3]
10. DATA[4]
11. DATA[5]
12. DATA[6]
13. DATA[7]
14. DATA[8]
15. DATA[9]
16. DATA[10]
17. DATA[11]
18. DATA[12]
19. DATA[13]
20. DATA[14]
21. DATA[15]
22. GND
23. GND
24. NC

Functional Features

• High-speed data transfer
• Low power consumption
• Non-volatile memory retains data even when power is disconnected
• Supports advanced memory management features
• Error correction capabilities for reliable data storage

Advantages and Disadvantages

Advantages

• Fast data transfer rate
• Low power consumption
• Reliable and durable non-volatile memory
• Supports advanced memory management features

Disadvantages

• Limited storage capacity (1 Gb)
• Higher cost compared to traditional memory options

Working Principles

The MX30UF1G18AC-TI is based on flash memory technology. It utilizes a combination of floating-gate transistors to store data. When data is written, charges are trapped in the floating gate, altering the transistor's conductive properties. This allows for non-volatile storage of information. The memory can be read by applying appropriate voltages to the transistors, which then produce electrical signals corresponding to the stored data.

Detailed Application Field Plans

The MX30UF1G18AC-TI is commonly used in various electronic devices that require high-speed, low-power, and reliable non-volatile memory. Some application fields include:

1. Mobile devices (smartphones, tablets)
2. Solid-state drives (SSDs)
3. Automotive electronics (infotainment systems, navigation systems)
4. Industrial control systems
5. Internet of Things (IoT) devices

Detailed and Complete Alternative Models

1. MX30UF1G18AC-TI: 1 Gb density, UFS interface
2. MX60UF2G36AC-TI: 2 Gb density, UFS interface
3. MX120UF4G72AC-TI: 4 Gb density, UFS interface
4. MX240UF8G144AC-TI: 8 Gb density, UFS interface
5. MX480UF16G288AC-TI: 16 Gb density, UFS interface

These alternative models offer higher storage capacities while maintaining similar characteristics and functionality.

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